|
| MOQ: | 1 set |
| Price: | 5000-20000 USD/set |
| Standard Packaging: | upon request |
| Delivery Period: | 15-30 work days |
| Payment Method: | T/T |
Application introduction:
Preparation of electronic ceramic materials: Electronic ceramic materials such as piezoelectric ceramics and ferroelectric ceramics have very high requirements for the particle size and purity of raw materials. The short-grinding ceramic ball mill can grind raw materials to a nanometer-level particle size without introducing impurities, meeting the production requirements of electronic ceramic materials.
Semiconductor material processing: In the production process of semiconductor materials, materials such as silicon wafers need to be ground and polished. The short-grinding ceramic ball mill can be used for the preliminary grinding treatment of semiconductor materials and provide a basis for subsequent processes such as polishing.
Features: This equipment has the characteristics of low investment, being more energy-efficient than similar products, novel structure, easy operation, safe use, and stable and reliable performance. It has ceramic grinding media, high product purity, and good product particle size uniformity. Simple operation and low maintenance cost. Strong applicability.
Model specifications:
| Model | Loading quantity (ton/time) | Cylinder speed (rp/m) | Reference power(KW) |
| 800×600 | 0.075 | 42 | 3 |
| 900×1200 | 0.2 | 38.5 | 5.5 |
| 1300×1500 | 0.5 | 33 | 7.5 |
| 1500×1800 | 1.2 | 28.5 | 11 |
| 1800×2000 | 1.5 | 24 | 15 |
|
|
| MOQ: | 1 set |
| Price: | 5000-20000 USD/set |
| Standard Packaging: | upon request |
| Delivery Period: | 15-30 work days |
| Payment Method: | T/T |
Application introduction:
Preparation of electronic ceramic materials: Electronic ceramic materials such as piezoelectric ceramics and ferroelectric ceramics have very high requirements for the particle size and purity of raw materials. The short-grinding ceramic ball mill can grind raw materials to a nanometer-level particle size without introducing impurities, meeting the production requirements of electronic ceramic materials.
Semiconductor material processing: In the production process of semiconductor materials, materials such as silicon wafers need to be ground and polished. The short-grinding ceramic ball mill can be used for the preliminary grinding treatment of semiconductor materials and provide a basis for subsequent processes such as polishing.
Features: This equipment has the characteristics of low investment, being more energy-efficient than similar products, novel structure, easy operation, safe use, and stable and reliable performance. It has ceramic grinding media, high product purity, and good product particle size uniformity. Simple operation and low maintenance cost. Strong applicability.
Model specifications:
| Model | Loading quantity (ton/time) | Cylinder speed (rp/m) | Reference power(KW) |
| 800×600 | 0.075 | 42 | 3 |
| 900×1200 | 0.2 | 38.5 | 5.5 |
| 1300×1500 | 0.5 | 33 | 7.5 |
| 1500×1800 | 1.2 | 28.5 | 11 |
| 1800×2000 | 1.5 | 24 | 15 |
Address
Room 709, C building,Yintaicheng,Lutai rosd High tech zone,Zibo city, Shandong,China
Tel
+86 13864434106
